High power high frequency transmission devices are being used extensively to enable faster data transmission and smarter function in many applications, such as automotive radar sensors, 5G telecommunication devices and infrastructures.
Category: BN Powders
Heat is one of the major enemies of today’s electronic components and assemblies. It shortens service life and threatens reliability. The challenge grows greater as designers and fabricators are asked to produce assemblies that are smaller and faster, making the need for heat dissipation greater than ever before.
As more and higher power chips are incorporated into smaller size electronic devices used in electric vehicles, 5G telecommunication, LED lighting, etc., power density increases tremendously.
Momentive Technologies’ high quality agglomerate h-BN powder delivers high performance in all directions
Boron Nitride is one of the most attractive fillers for improving thermal conductivity while maintaining the electrical insulation of polymeric thermal management materials used in electronic devices.