Category: Match to Products

Boron Nitride for Thermal Management

Heat is one of the major enemies of today’s electronic components and assemblies. It shortens service life and threatens reliability. The challenge grows greater as designers and fabricators are asked to produce assemblies that are smaller and faster, making the need for heat dissipation greater than ever before.

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台湾办事处

No. 6, 10th Floor, No. 65, Gaotie 7th Road, Zhubei City, Hsinchu, Taiwan

中国办事处

No. 1088 Yuanshen road, Suite 1101 Ping’an Fortune Building, Shanghai 200122, China

+86 21 5848 1388

한국사무소

Momentive Technologies Korea Ltd.

7F of WONIK Building, 20, Pangyo-ro 255beon-gil, Bundang-gu, Seongnam-si, Gyeonggi-do,
Republic of Korea

+82 31 8038 9069

日本オフィス

Momentive Technologies Japan KK

Park West 10th floor, 6-12-1, Nishi-Shinjuku, Shinjuku-ku, Tokyo 1600023,
Japan

+81 3 6721 1910