Strongsville, Ohio, USA — Momentive Technologies, a leader in advanced materials solutions, is excited to announce two key additions to its leadership team. Dr. Martin Panchula has been appointed as Vice
Momentive Technologies is excited to share insights from an article on EV Tech Insider that highlights the remarkable advantages of boron nitride as a thermal conductor in electric vehicle (EV) power electronics. This innovative material offers superior thermal management, electrical insulation, and chemical stability, making it a crucial component in enhancing the efficiency and reliability of EV power systems. Learn more about how boron nitride is revolutionizing electric vehicle technology by visiting the full article on EV Tech Insider.
Momentive Technologies (MT) was recently awarded the prestigious “2023 Excellent Supplier – Service Stars Reward” at the Ferrotec Global Suppliers Conference, held shortly after SEMICON CHINA. This accolade reflects decades of dedicated service and strong partnership between MT and Ferrotec, particularly with their Quartz Business Unit (BU).
Join us at the Thermal Management Expo 2024 to explore the revolutionary role of Boron Nitride in thermal management across high-tech industries, including EVs and telecommunications. Discover how BN’s superior properties are shaping the future of high-power systems.
CLEVELAND (Mar 11, 2024) – Momentive Technologies, an industry leader in advanced materials in Quartz and Ceramics, is thrilled to announce the appointment of Mark A. Wolf as its new
High power high frequency transmission devices are being used extensively to enable faster data transmission and smarter function in many applications, such as automotive radar sensors, 5G telecommunication devices and infrastructures.
EVs consist of multiple components requiring higher power, faster data transmission, lighter weight, and smaller size. These demands can lead to increased heat generation and transmission loss.
Boron nitride’s crystal structure makes it an ideal lubricant, as crystals are able to slide easily between mating surfaces.
Heat is one of the major enemies of today’s electronic components and assemblies. It shortens service life and threatens reliability. The challenge grows greater as designers and fabricators are asked to produce assemblies that are smaller and faster, making the need for heat dissipation greater than ever before.
As more and higher power chips are incorporated into smaller size electronic devices used in electric vehicles, 5G telecommunication, LED lighting, etc., power density increases tremendously.
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