Momentive Technologies takes part in panel discussion at Thermal Management Expo

Bei Xiang, Master Application Development Engineer, will be joining an esteemed panel of speakers from across the industry for a conference session focused on Assessing the Outlook for Thermal Management in Consumer Electronic Devices on Tuesday May 2.

Driving Innovation with Thermal Management in Consumer Electronics

There is no one-size-fits-all approach to system cooling, certainly in the very diverse field of consumer electronic devices. The ability to control temperature and performance within cost and form factor requirements can make or break a product. What are the latest materials, coolants, tools and technologies that will drive the industry forward in 2023? Specialists from different sides of the puzzle will explore:

  • the 5G landscape and why thermal management is critical for cell phone devices
  • high performance lightweight ceramics for critical thermal management in electronic devices
  • insulation for thermal management across a wide range of wearable consumer products
  • real world experiences and challenges for end users that must be addressed to drive innovation

Read the Interview of Bei Xiang on Thermal Management Expo‘s site

To see the conference’s full agenda, click here.


No. 6, 10th Floor, No. 65, Gaotie 7th Road, Zhubei City, Hsinchu, Taiwan


No. 1088 Yuanshen road, Suite 1101 Ping’an Fortune Building, Shanghai 200122, China

+86 21 5848 1388


Momentive Technologies Korea Ltd.

7F of WONIK Building, 20, Pangyo-ro 255beon-gil, Bundang-gu, Seongnam-si, Gyeonggi-do,
Republic of Korea

+82 31 8038 9069


Momentive Technologies Japan KK

Park West 10th floor, 6-12-1, Nishi-Shinjuku, Shinjuku-ku, Tokyo 1600023,

+81 3 6721 1910