Ceramics Products

TMP-EX Composite Heat Sink

CTE Matched

Momentive Performance Materials Inc. offers a
unique heat sink product that contains a TPG*
core (>1500 W/m-K) and a coefficient of thermal
expansion (CTE) matched enclosure for superior
thermal management performance. The TMP-EX
composite heat sink provides:

  • High thermal conductivity
  • CTE matching to semiconductors
  • Light weight

Typical Physical Properties

  • Parallelism: 0.0005″ (0.01mm)
  • Flatness: 0.001″/1″ (1μm/1mm)
  • Surface Finish: Ra 16 μin (0.4 μm)
  • Plating: Ni 160-250 μin (4-6 μm) / Au 40-80 μin (1-2 μm)

Reliability

Packaging standards (MIL-STD-883H) qualified:

  • Hermeticity
  • Thermal cycling
  • Shock & vibration resistances

Potential Applications

  • Power electronic package
  • RF & microwave package
  • Laser diode
  • High power LED

Comparison of Measured Thermal Conductivity

Before and After Reliability Tests
Comparison-of-Measured-Thermal-Conductivity
Note: Test data. Actual results may vary.

Schematic Illustration of CTE Matched TMP-EX Heat Sink

Comparison of Simulated Thermal Performance

Typical Material Properties

Material In-Plane TC (W/m•K) Thru-Plane TC (W/m•K) In-Plane CTE (ppm/°C) Density (gm/cm³)
Aluminum
218
218
23
2.7
Copper
400
400
17
8.9
TMP-EX (AlSiC12)(1)
1060
435
11
2.5
W85Cu
190
190
7.0
15.6
TMP-EX (W85Cu)(1)
1063
455
7.0
6.7
Mo70Cu
1063
1063
1063
1063
TMP-EX (Mo70Cu)(1)
1063
1063
1063
1063

(1) Estimation is based on 67% TPG loading.
Standard off-the-shelf parts are available upon request.

Note: Typical properties are average data and are not to be used as or to develop specifications.

*TPG is a trademark of Momentive Performance Materials Inc.

Download the product datasheet

CTE Matched TMP-EX Composite Heat Sink

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