High Thermal Conductivity Graphite Products-2024

Ceramics Products Highly-Oriented Pyrolytic Graphite (HOPG) More intense, efficient x-rays and neutron beams Made of highly-oriented forms of high-purity pyrolytic graphite, Momentive Technologies graphite monochromators are shown to diffract X-rays and neutrons with greater efficiency than any other competitive material. Offering the lowest mosaic spread available, Momentive Technologies HOPG materials are excellent for beam conditioning […]

Ceramics Products High Thermal Conductivity Heat Sinks Increased power output and product reliability Encapsulating our high thermal conductivity (typically 1700W/mK) Thermal Pyrolytic Graphite (TPG) material within a structural metal or ceramic shell, Momentive Technologies has developed a complete line of high–thermal conductivity heat sinks. Our products are an excellent choice for board- and die-level systems

TC1050® Heat Spreader High Conductivity TC1050® heat spreader consists of a TPG® core encapsulated within a structural shell. The TPG® provides a highly conductive path while the encapsulation material provides the structure (strength, stiffness, and coefficient of thermal expansion). Common encapsulation materials include: Aluminum (TC1050®.AL) Copper (TC1050®.CU) Other available encapsulations and systems include WCu, MoCu,

Ceramics Products TMP-EX Composite Heat Sink CTE Matched Momentive Performance Materials Inc. offers aunique heat sink product that contains a TPG*core (>1500 W/m-K) and a coefficient of thermalexpansion (CTE) matched enclosure for superiorthermal management performance. The TMP-EXcomposite heat sink provides: High thermal conductivity CTE matching to semiconductors Light weight Typical Physical Properties Parallelism: 0.0005″ (0.01mm)