Ceramics Products

TC1050® Heat Spreader

High Conductivity

TC1050® heat spreader consists of a TPG® core encapsulated within a structural shell. The TPG® provides a highly conductive path while the encapsulation material provides the structure (strength, stiffness, and coefficient of thermal expansion). Common encapsulation materials include:
  • Aluminum (TC1050®.AL)
  • Copper (TC1050®.CU)
  • Other available encapsulations and systems include WCu, MoCu, AlSiC, stainless steel, Ni, etc.

Key Features

  • Significant improvement in thermal conductivity
  • Low thermal interface resistance
  • Reduction in component mass
  • Adjustable coefficient of thermal expansion
  • Wide operating temperature range
  • Mechanical load bearing
  • Hermeticity higher than 10-8 atm.cc/s
  • Vibration and shock resistance
  • Machinable
  • Plateable
  • Size up to 4 ft2 (0.37 m2) (TC1050®.AL)

Key Benefits

  • Improved Temperature Uniformity
  • Improved Component Reliability
  • Reduced Operation Temperature
  • Increased Power
  • Reduced Weight
  • Reduced Cooling Capacity Needs

Potential Applications

  • Heat spreader in electronic packaging
  • Thermal cores for PWB’s
  • Finned heat sinks
  • Avionic thermal cores
  • Satellite traveling wave tube (TWT) mounts
  • Electronic chassis
  • Cold plates in radar systems

Typical Properties of Heat Spreader Materials

Material In-Plane TC (W/mK) Thru-Plane TC (W/mK) In-Plane CTE (ppm/°C) Specific Gravity Specific In-Plane TC(1)
Aluminum
218
218
23
2.7
81
Copper
400
400
17
8.9
45
AlSiC-12
180
180
11
2.9
62
CuW
185
185
8.3
15.2
12
CVD Diamond
1100-1800
1100-1800
1-2
3.5
210-510
TPG® Graphite
1500+
10
-1
2.3
650
Typical properties are average data and are not to be used as or to develop specifications. (1) In-Plane thermal conductivity divided by specific gravity.

Comparison of Heat Spreader Performance

Heat-Spreader-Performance

IR Image with 45 Watt heat loading and 20°C Cooling. Note: Test Data. Actual Results may vary.

Examples of TC1050® Heat Spreaders and Cross-Section View

TC1050®-Heat-Spreaders-and-Cross-Section-View

Download the product datasheet

TC1050® Heat Spreader

This field is for validation purposes and should be left unchanged.

台湾办事处

No. 6, 10th Floor, No. 65, Gaotie 7th Road, Zhubei City, Hsinchu, Taiwan

中国办事处

No. 1088 Yuanshen road, Suite 1101 Ping’an Fortune Building, Shanghai 200122, China

+86 21 5848 1388

한국사무소

Momentive Technologies Korea Ltd.

7F of WONIK Building, 20, Pangyo-ro 255beon-gil, Bundang-gu, Seongnam-si, Gyeonggi-do,
Republic of Korea

+82 31 8038 9069

日本オフィス

Momentive Technologies Japan KK

Park West 10th floor, 6-12-1, Nishi-Shinjuku, Shinjuku-ku, Tokyo 1600023,
Japan

+81 3 6721 1910