TC1050® Heat Spreader
Description
TC1050® heat spreader consists of a TPG® core encapsulated within a structural shell. The TPG® provides a highly conductive path while the encapsulation material provides the structure (strength, stiffness, and coefficient of thermal expansion). Common encapsulation materials include:
- Aluminum (TC1050®.AL)
- Copper (TC1050®.CU)
- Other available encapsulations and systems include WCu, MoCu, AlSiC, stainless steel, Ni, etc.
Features and Benefits
Features
- Significant improvement in thermal
conductivity - Low thermal interface resistance
- Reduction in component mass
- Adjustable coefficient of thermal expansion
- Wide operating temperature range
- Mechanical load bearing
- Hermeticity higher than 10-8 atm.cc/s
- Vibration and shock resistance
- Machinable
- Plateable
- Size up to 4 ft2 (0.37 m2) (TC1050®.AL)
Benefits
- Improved Temperature Uniformity
- Improved Component Reliability
- Reduced Operation Temperature
- Increased Power
- Reduced Weight
- Reduced Cooling Capacity Needs
Technical Specs
Typical Properties of Heat Spreader Materials
| Material | In-Plane TC (W/mK) | Thru-Plane TC (W/mK) | In-Plane CTE (ppm/°C) | Specific Gravity | Specific In-Plane TC(1) |
|---|---|---|---|---|---|
|
Aluminum |
218 |
218 |
23 |
2.7 |
81 |
|
Copper |
400 |
400 |
17 |
8.9 |
45 |
|
AlSiC-12 |
180 |
180 |
11 |
2.9 |
62 |
|
CuW |
185 |
185 |
8.3 |
15.2 |
12 |
|
CVD Diamond |
1100-1800 |
1100-1800 |
1-2 |
3.5 |
210-510 |
|
TPG® Graphite |
1500+ |
10 |
-1 |
2.3 |
650 |
Typical properties are average data and are not to be used as or to develop specifications.
(1) In-Plane thermal conductivity divided by specific gravity.
Comparison of Heat Spreader Performance
IR image with 45 Watt heat loading and 20-degree Celsius cooling
Examples of TC1050® Heat Spreaders and Cross-Section View
Applications
- Heat spreader in electronic packaging
- Thermal cores for PWB’s
- Finned heat sinks
- Avionic thermal cores
- Satellite traveling wave tube (TWT) mounts
- Electronic chassis
- Cold plates in radar systems
